Glass and metal sintered package enclosure
This kind of package for our company in the line represents the variety, has small volume and light weight, high integration, mature technology, can effectively ensure the long-term stability of the semiconductor chip, it has high reliability. The shell is mainly used for operational amplifier, linear amplifier, voltage regulator, analog multiplier divider, time base circuit, such as logarithmic amplifier analog integrated circuit and interface integrated circuit.
In the choice of materials, package with metal material can be used 4J29 (kovar alloy), iron nickel cobalt alloy, 4J42 alloy, 4J50 iron nickel iron nickel alloy, 10# steel, stainless steel, silicon aluminum, copper and other metal materials, and the sealing material can choose Molybdenum Group glass and Steel Group as the molten glass insulation sealing material, brazing material with Ag72Cu28 as the main welding materials.
In addition to the special requirements of the shell size tolerance, generally by m in the GB1804-2000 class.
The surface of the shell can be plated on the surface of the request for gold plating, nickel plating and local plating.
The internal and external lead lengths of the shell can be determined according to the user's requirements.
According to the user requirements for the design and production of the shell.
L working temperature: -55 to 120 DEG C
High - voltage: 1000V (50Hz)
Voltage: 20MPa, 1H
Insulation resistance: 5000M = - Omega
L air tightness: less than 1 were 10-4Pa cm-3/s (He)
Salt mist experiment: 5%, 48h moisture proof, mildew proof performance conforms to the GJB598A-96 standard.
High impact: -55 to +150 DEG C, 15
L working height: the altitude of 30000m